BYCHIPS is the stocking distributor for CMF55604R00BER670, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for CMF55604R00BER670 by email, we will give you a best price according your plan.
Buy CMF55604R00BER670 with BYCHPS
Buy with guarantee
CMF55604R00BER670
- Part Number:
- CMF55604R00BER670
- Manufacturer:
- Dale / Vishay
- Description:
- RES 604 OHM 1/2W .1% AXIAL
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19659 Pieces
- Data sheet:
- CMF55604R00BER670.pdf
Introduction
Specifications
| Tolerance: | ±0.1% |
|---|---|
| Temperature Coefficient: | ±25ppm/°C |
| Supplier Device Package: | Axial |
| Size / Dimension: | 0.090" Dia x 0.240" L (2.29mm x 6.10mm) |
| Series: | CMF |
| Resistance (Ohms): | 604 |
| Power (Watts): | 0.5W, 1/2W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | Axial |
| Operating Temperature: | -55°C ~ 175°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | CMF55604R00BER670 |
| Height - Seated (Max): | - |
| Features: | Flame Retardant Coating, Moisture Resistant, Safety |
| Failure Rate: | - |
| Expanded Description: | 604 Ohm ±0.1% 0.5W, 1/2W Through Hole Resistor Axial Flame Retardant Coating, Moisture Resistant, Safety Metal Film |
| Description: | RES 604 OHM 1/2W .1% AXIAL |
| Composition: | Metal Film |
| Email: | [email protected] |
Related parts for CMF55604R00BER670
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog