Supplier Device Package: | 1156-FCBGA (35x35) |
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Speed: | 533MHz, 1.3GHz |
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Series: | Zynq® UltraScale+™ MPSoC CG |
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Primary Attributes: | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
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Peripherals: | DMA, WDT |
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Packaging: | Tray |
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Package / Case: | 1156-BBGA, FCBGA |
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Operating Temperature: | 0°C ~ 100°C (TJ) |
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Number of I/O: | 328 |
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Moisture Sensitivity Level (MSL): | 4 (72 Hours) |
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Manufacturer Standard Lead Time: | 8 Weeks |
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Manufacturer Part Number: | XCZU9CG-1FFVB1156E |
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MCU RAM: | 256KB |
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MCU Flash: | - |
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Expanded Description: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 256KB 533MHz, 1.3GHz 1156-FCBGA (35x35) |
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Description: | IC FPGA 328 I/O 1156FCBGA |
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Core Processor: | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
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Connectivity: | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
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Architecture: | MCU, FPGA |
Email: | sales@bychips.com |